Photovoltaic Tungsten Wire

CTIA photovoltaic tungsten wire refers to ultra-fine tungsten wire used in Diamond Wire Sawing (DWS) for photovoltaic silicon wafer cutting. Tungsten wire is typically used as the base wire of diamond composite cutting wire, where diamond abrasives are fixed by electroplating or bonding to form a cutting-capable wire. It mainly provides stable support and geometric consistency during operation.

Photovoltaic wafer cutting requires high stability, consistency, and strength of the wire. Procurement typically focuses on diameter tolerance, tensile strength, dimensional consistency, surface quality, and batch stability, as these parameters directly affect tension control, operational stability, and wafer thickness consistency. The material must maintain stable mechanical properties and consistent performance to ensure process controllability under high-speed multi-wire cutting and long-duration operation. Tungsten wire, with its high elastic modulus and tensile strength, exhibits lower deformation under the same tension, helping reduce wire vibration and improve cutting path stability. Its dimensional stability also supports consistent performance under continuous load, meeting high-precision cutting requirements.

Wire diameter is a key parameter in photovoltaic tungsten wire selection. The wire is mainly in the ultra-fine range, typically Φ20μm–Φ50μm, with Φ30μm–Φ40μm providing a good balance between strength and cutting efficiency. For higher precision or lower cutting loss, diameters can be reduced to Φ10μm–Φ20μm, although this range requires stricter control of material uniformity and wire breakage, and is mainly used in R&D. In some auxiliary or specific applications, diameters of Φ50μm–Φ80μm are also used. CTIA GROUP provides ultra-fine tungsten wire in the range of Φ10μm–80μm, with controlled diameter tolerance, roundness, and consistency to meet different cutting process requirements.

Diameter tolerance is typically controlled within ±1μm, and high-consistency products can reach ±0.5μm. This precision directly affects tension uniformity in Multi-wire Saw (MWS) operations and further influences wafer thickness consistency and surface quality. Tungsten wire is usually supplied as continuous long wire wound on spools, with lengths ranging from several thousand to tens of thousands of meters to meet continuous cutting requirements.

From CTIA GROUP’s perspective, photovoltaic tungsten wire is a functional material for high-precision cutting, with value reflected in controllable dimensions, stable mechanical properties, and high processing consistency. It provides reliable support for tension control, cutting path stability, and cutting consistency in large-size and ultra-thin silicon wafer processing. As photovoltaic manufacturing advances toward higher precision and thinner wafers, tungsten wire will continue to play an important role in various cutting processes and specialized applications.

For any inquiry, please contact tungsten wire manufacturer: CTIA GROUP

Email: sales@chinatungsten.com

Tel: 0086 592 5129696 / 0086 592 5129595

Website: www.tungsten.com.cn

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